JPS6410935B2 - - Google Patents

Info

Publication number
JPS6410935B2
JPS6410935B2 JP15835880A JP15835880A JPS6410935B2 JP S6410935 B2 JPS6410935 B2 JP S6410935B2 JP 15835880 A JP15835880 A JP 15835880A JP 15835880 A JP15835880 A JP 15835880A JP S6410935 B2 JPS6410935 B2 JP S6410935B2
Authority
JP
Japan
Prior art keywords
die
adhesive sheet
needle
supply ring
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15835880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5783038A (en
Inventor
Masayuki Shimura
Yoshimitsu Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP15835880A priority Critical patent/JPS5783038A/ja
Publication of JPS5783038A publication Critical patent/JPS5783038A/ja
Publication of JPS6410935B2 publication Critical patent/JPS6410935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP15835880A 1980-11-11 1980-11-11 Method for die pick-up Granted JPS5783038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Publications (2)

Publication Number Publication Date
JPS5783038A JPS5783038A (en) 1982-05-24
JPS6410935B2 true JPS6410935B2 (en]) 1989-02-22

Family

ID=15669918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835880A Granted JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Country Status (1)

Country Link
JP (1) JPS5783038A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974733U (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 チツプ分離機構
JPH0642341Y2 (ja) * 1984-07-20 1994-11-02 日本電気株式会社 マウント装置
JP2619443B2 (ja) * 1987-12-14 1997-06-11 ローム株式会社 ペレットのピックアップ方法
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Also Published As

Publication number Publication date
JPS5783038A (en) 1982-05-24

Similar Documents

Publication Publication Date Title
JP2010114441A (ja) ダイエジェクタ
JPS6410935B2 (en])
JP2001196443A (ja) 半導体チップのピックアップ装置およびピックアップ方法
KR102068358B1 (ko) 반도체 다이 분리장치
KR100639553B1 (ko) 다이 픽업 장치
US5755373A (en) Die push-up device
JPH0774188A (ja) ハイブリッドダイボンダ用のダイエジェクト装置
JPS62210635A (ja) 物体の分離方法及び装置
CN215683134U (zh) 嵌铜机及铜块取出装置
JPS63169242A (ja) 基板矯正保持方法及びその装置
JPH0376139A (ja) 半導体素子突上げ方法
JP2619443B2 (ja) ペレットのピックアップ方法
JP3440803B2 (ja) チップの突き上げ方法
JPS6242379B2 (en])
JPH0217480Y2 (en])
JPH05211184A (ja) ダイボンディング装置
CN216354255U (zh) 一种剥离装置及剥离系统
JPH0144018B2 (en])
JPH01169937A (ja) 半導体ペレットの外観検査装置
JPH0214547A (ja) 電子部品のピックアップ装置
JPH0671155B2 (ja) 電子部品の突上げ装置
JP2571153Y2 (ja) 半導体部品供給装置
JP2514697Y2 (ja) マウンタ
JPH0135473Y2 (en])
JPH0354467B2 (en])